The EU-project „Trusted Embedded Computing“ (TECOM) is a research and development project funded by the European Commission within the 7th framework program (EU-FP7). The TECOM project started in January 2008 with a run time of 39 months. The TECOM consortium consists of eleven European partners and aims at developing Trusted Computing (TC) technology especially for embedded platforms.
The main aspects and goals of TECOM are:
- Development of large scale circuits to develop trustworthy hardware, such as a Trusted Platform Module (TPM), for easy integration into mobile components.
- Trusted operating systems, which take into account the dedicated resource limitations of mobile devices. By using virtualisation technology, the trusted operating systems are the foundation for building secure mobile devices.
- The development of an embedded security software layer, providing cryptographic functionality, trusted hardware device drivers as well as additional security services. One example of a security service is a secure graphical user interface. Additionally management functionality is also available through the embedded security software layer in order to attest the platform configuration of the mobile device to an external entity.
- Usage of trusted communication and network protocols (with respect to Trusted Network Connect) in the embedded area.
The developed components and services as well as their interoperability within the TECOM-project will be demonstrated in different usage scenarios, such as secure smartphones or smart meter.
Rohde & Schwarz Cybersecurity GmbH is – beneath Infineon – the second largest project partner and focusses on the development of Trusted Computing components especially targeting the limited resources in the mobile environment. For instance, Rohde & Schwarz Cybersecurity GmbH developed a Mobile Trusted Module (MTM) as well as a small and efficient Trusted Software Stack (µTSS) according to the TCG-specifikation. Additionally, Rohde & Schwarz Cybersecurity GmbH is the work package leader for work package 3. There, Rohde & Schwarz Cybersecurity develops an „Embedded Security Layer“ forming an integrational security layer for the TECOM architecture.
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